Founded in 2006 by material science and engineering scientist in Ningbo, China , Sibranch Microelectronics aims to provide semiconductor wafer and service in China and all over the world. Our main products including standard silicon wafers SSP (single side polished),DSP (Double side polished), test silicon wafers and prime silicon wafers , SOI (Silicon on Insulator) wafer and coinroll wafers with diameter up to 12 inch, CZ/MCZ/FZ,Neutron radiation, almost any orientation, off cut, high and low resistivity,ultra flat, ultra thin, thick wafers etc.


Uyezve, chikwata chedu inopa firimu deposition mabasa (oxide, Nitride, Metal), nesilicon epitaxial zvitete uye epitaxial mabasa (sos, Gan, GOI etc), uwandu, shure kukuya, dicing, etc.

Nesuwo kupa zvitete pazasi:

Nesafiri zvitete : 2 kusvika 6 padiki, A-ndege, R-ndege, M-ndege, C-ndege, epi-chiPolish, nemicheka ivhu, etc.

GaAs zvitete : 2 kusvika 6 padiki, P & N mhando, Semi-anoitisa, Semi-insulating, etc.

SiC zvitete : 2 kusvika 4 padiki, 4h-N, 6-N, 6-SI, etc.

Glass zvitete : 2 kusvika 8 padiki Fused Silica, Borofloat, B270 etc.

Single mechanical Goldstone zvitete : 2-6 padiki, X-chekawo, Y-chekawo, Z-akavezwa, etc.