Growth |
CZ, MCZ, FZ |
Grade |
Prime, Test, Dummy, etc. |
Diameter |
Other diameters,such as 10mm,12.7mm,1.5″,35mm,40mm,2.5″ are also possible |
Thickness |
50~3000um |
Finish |
As cut, lapped, etched,SSP,DSP, etc |
Orientation |
(100) (111)(110) (211)(311) (511)(531) etc |
Off cut |
Up to 4 deg |
Type/Dopant |
P/B, N/Phos, N/As, N/Sb, Intrinsic |
Resistivity |
FZ : Up to 20k ohm-cm |
|
CZ/MCZ : From 0.001 to 150 ohm-cm |
Thin films |
* PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo,etc |
|
* PECVD: Oxide, Nitride, SiC,etc |
|
* Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc). |
Processes |
DSP, ultra thin, ultra flat, etc. |
|
Downsizing, back grinding, dicing , etc. |
|
MEMS |