| Growth | CZ, MCZ, FZ |
| Grade | Prime, Test, Dummy, etc. |
| Diameter | Other diameters,such as 10mm,12.7mm,1.5″,35mm,40mm,2.5″ are also possible |
| Thickness | 50~3000um |
| Finish | As cut, lapped, etched,SSP,DSP, etc |
| Orientation | (100) (111)(110) (211)(311) (511)(531) etc |
| Off cut | Up to 4 deg |
| Type/Dopant | P/B, N/Phos, N/As, N/Sb, Intrinsic |
| Resistivity | FZ : Up to 20k ohm-cm |
| CZ/MCZ : From 0.001 to 150 ohm-cm | |
| Thin films | * PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo,etc |
| * PECVD: Oxide, Nitride, SiC,etc | |
| * Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc). | |
| Processes | DSP, ultra thin, ultra flat, etc. |
| Downsizing, back grinding, dicing , etc. | |
| MEMS |
