Sobre nós

Founded in 2006 by material science and engineering scientist in Ningbo, China , Sibranch Microelectronics aims to provide semiconductor wafer and service in China and all over the world. Our main products including standard silicon wafers SSP (single side polished),DSP (Double side polished), test silicon wafers and prime silicon wafers , SOI (Silicon on Insulator) wafer and coinroll wafers with diameter up to 12 inch, CZ/MCZ/FZ,Neutron radiation, almost any orientation, off cut, high and low resistivity,ultra flat, ultra thin, thick wafers etc.


Além disso, nossa equipe oferece serviços de filmes de deposição (óxido, nitreto, Metal), wafers epitaxiais de silício e serviços epitaxiais (SOS, GaN, GOI etc), downsizing, volta moer, cortar, etc.

Nós também fornecemos wafers abaixo:

Bolachas safira : 2 a 6 polegadas, A-plano, R-plano, H-plano, C-plano, epi-polonês, fina do solo, etc.

Bolachas GaAs : 2 a 6 polegadas, P & N tipo, semi-condutor, semi-isolante, etc.

Bolachas SiC : 2 a 4 polegadas, 4H-N, N-6H, 6H-SI, etc.

Bolachas de vidro : 2 a 8 polegadas sílica fundida, borofloat, B270, etc.

Bolachas individuais de cristal de quartzo : 6/2 polegada, X-cortadas, Y-corte, Z-corte, etc.