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      Small size(76/50.8/25.4mm) Wafer

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      GrowthCZ, MCZ, FZ
      GradePrime, Test, Dummy, etc.
      Diameter Other diameters,such as 10mm,12.7mm,1.5″,35mm,40mm,2.5″ are also possible
      Thickness 50~3000um
      Finish As cut, lapped, etched,SSP,DSP, etc
      Orientation (100) (111)(110) (211)(311) (511)(531)  etc
      Off cut Up to 4 deg
      Type/Dopant P/B, N/Phos, N/As, N/Sb, Intrinsic
      Resistivity FZ : Up to 20k ohm-cm
        CZ/MCZ : From 0.001 to 150 ohm-cm
      Thin films * PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo,etc
        * PECVD: Oxide, Nitride, SiC,etc
        * Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc). 
      Processes DSP, ultra thin, ultra flat, etc.

      Downsizing, back grinding, dicing , etc.

      MEMS



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