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      12 inch(300mm) Polished Wafer

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      Growth CZ, MCZ, FZ
      Grade Prime, Test, Dummy, etc.
      Diameter 12 inch / 300mm
      Thickness 600~800um 
      Finish As cut, lapped, DSP(300nm, 200nm,120nm, 90nm,65nm, 37nm), etc
      Orientation (100)   etc
      Off cut Up to 4 deg
      Type/Dopant P/B, N/Phos, N/As, N/Sb, Intrinsic
      Resistivity CZ/MCZ : From 0.001 to 200 ohm-cm
        FZ : Up to 5000 ohm-cm
      Thin films * PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20,000 Å / ± 5 %
        * LPCVD/PECVD: Oxide, Nitride, SiC, etc , Coating thicknesses up to 200,000 Å / ± 3 %
        * Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc)
      Processes DSP, ultra thin, ultra flat, etc.

      Downsizing, back grinding, dicing , etc.

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