As the basic component of semiconductor, silicon wafer is a very important component for all electronic products such as computers, communication and consumer electronics. Silicon wafer through high – tech design, a thin disk shape, diameter is divided into various sizes (1 “to 12R...
The wafer goes through a series of processes to form a silicon substrate, known as a wafer, that meets the requirements of semiconductor manufacturing. The basic processing process is: appearance finishing, slicing, chamfering, grinding and polishing, etc.
Exterior finishing
(1) cutting section
T...
China International Capital Corporation (CICC) said in an article on its WeChat official account that since the third quarter of 2020, the global semiconductor industry has experienced a serious chip shortage, including automotive, mobile phone, security and other industries.
CICC believes that t...
As a multi-billion dollar industry, the market for semiconductor materials is not very large, but there is a wide variety of materials within it, and the market size of a single product is small, the technical requirements are high, and the differences between sub-industries are large. Among them...
Shinetsu, the world’s largest semiconductor wafer maker, announced in a statement on its website that it will raise prices of all its silicon products by 10 to 20 percent from April.
The price increase, Shinetsu’s first in three years after 2018, was driven by strong demand growth in ...
Quartz glass sheet, usually cut from quartz glass and made of grinding, its silica content can reach more than 99.99%. Hardness for Mo-type seven, with high temperature resistance, low thermal expansion coefficient, thermal shock resistance and good electrical insulation performance, etc.
Quartz ...
MEMS, Micro-Electro-Mechanical System, also known as microelectromechanical systems, Microsystems, micromachines, etc., refer to high-tech devices that are a few millimeters or smaller in size. High-tech devices in the size of a few millimeters or less.
Microelectromechanical system (MEMS) is an...
Have you ever been pained by the thought of chips being cut off around a wafer?
When making A CPU, GPU, or memory or SOLID-state disk chip, the corners of each crystal circle are cut off a lot (figure below) :
Considering Intel’s currently tight 14nm capacity (and TSMC’s 7nm capacity...
Gallium arsenide, chemical formula GaAs. Black gray solid, melting point 1238℃. It is stable in the air at temperatures below 600 ° C and is impervious to non-oxidizing acids.
Gallium arsenide is an important semiconductor material. Ⅲ – Ⅴ clan compound semiconductor. It is a sphalerite lat...
When we look at the substrates or chips of semiconductor silicon or other types of materials, we often see technical indicators such as TTV, BOW, WARP, and perhaps even TIR, STIR, LTV, etc. What parameters do they represent?
TTV — Total Thickness Variation, Total Thickness Variation
BOW, b...
A wafer is a thin piece of silicon about a millimeter thick that has a very high degree of flatness on the surface due to the very high requirements of the manufacturing process. The specific application of a wafer determines the type of wafer length required. For example, after polysilicon melts...
At present, the development of the third-generation semiconductor materials represented by silicon carbide (SiC) has begun to be paid attention to, and has been applied in the fields of smart power grid, electric vehicles, rail transit, new energy grid connection, switching power supply, industri...
