Founded in 2006 by material science and engineering scientist in Ningbo, China , Sibranch Microelectronics aims to provide semiconductor wafer and service in China and all over the world. Our main products including standard silicon wafers SSP (single side polished),DSP (Double side polished), test silicon wafers and prime silicon wafers , SOI (Silicon on Insulator) wafer and coinroll wafers with diameter up to 12 inch, CZ/MCZ/FZ,Neutron radiation, almost any orientation, off cut, high and low resistivity,ultra flat, ultra thin, thick wafers etc.
Turklāt mūsu komanda piedāvā plēves uzklāšanas pakalpojumus (oksīds, nitrīda, metāla), silīcija epitaksiālo vafeles un izmēģināšanas pakalpojumus (SOS, GAN, Indijas valdība uc), racionalizāciju, muguras slīpēšana, kubiņos utt.
Mēs arī sniegt vafeles zemāk:
Sapphire vafeles : 2 līdz 6 collu, A-plaknes, R-plakne, M-plakne, C-plakne, epi-polish, fine zemes, utt
GaAs vafeles : 2 līdz 6 inch, P & N tips, pusvadītāja, semi-izolācijas, utt
SiC vafeles : 2 līdz 4 collu, 4H-N, 6H-N, 6H-SI, utt
Stikla vafeles : 2 līdz 8 collu kvarcu, Borofloat, B270 uc
Single kristāla kvarca vafeles : 2-6 collu, X-cut, Y-cut, Z-cut, utt