Wafer down sizing by Laser Cutting


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 Laser Cutting Processing 
 
Step1:Photoresist Spin Coating ➠Step2:Backgrinding  ➠  Step3:Cleavage  ➠ 
Step4:Laser Cutting   ➠  Step5:Edge Rounding  ➠  Step6:Photoresist Removing 

sai12

8inch downsize to 6inch
8inch downsize to 4inch
8inch downsize to 3inch

xq2

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