Dicing & Back Grinding
Wafer Dicing & Back Grinding, Wafer Resizing
We provide quick and efficient custom wafer Dicing & Back Grinding and wafer resizing services. Over the years, we have worked with hundreds of satisfied customers all over the world. Our customers have been involved in an array of different industries, including MEMS, Military, Medical, Semiconductor and MicroOptics. This has allowed our team, which has a combined total of 20 years of experience, to work with virtually every type of material in the industry, including Alumina, BGA’s, Calcite, Ferrite, Fused Silica, Glass, Germanium, Gold, Lexan, PZT , Sapphire, SOI, SOS, EPI and Silicon wafers. We can accommodate all material sizes up to 300mm/ 12” in diameter and 10mm thick.