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Founded in 2006 by material science and engineering scientist in Ningbo, China , Sibranch Microelectronics aims to provide semiconductor wafer and service in China and all over the world. Our main products including standard silicon wafers SSP (single side polished),DSP (Double side polished), test silicon wafers and prime silicon wafers , SOI (Silicon on Insulator) wafer and coinroll wafers with diameter up to 12 inch, CZ/MCZ/FZ,Neutron radiation, almost any orientation, off cut, high and low resistivity,ultra flat, ultra thin, thick wafers etc.


In più, a nostra squatra di prupone servizii cosita PVD (Calcium, nitride, Metal), cialde epitaxial caldo e servizi epitaxial (SOS, Gan, GOI eccetra), Downsizing, daretu DING, dicing, ecc.

Avemu faci dinù, cialde sottu:

Cialde Rubis : 2 à 6 puseri, A-avión, R-avión, M-avión, C-avión, Pizz-Pierre Raffarin, in terra fina, etc.

Cialde GaAs : 2 à 6 puseri, P & N tippu, semi-cunnucennu, semi-insulating, etc.

Cialde Sic : 2 à 4 puseri, 4H-N, 6H-N, 6H-SI, etc.

Cialde Glass : 2 à 8 puseri titanate Silica, Borofloat, B270 etc.

Single cialde quartz : 2-6 puseri, X-taglio, Y-taglio, Z-taglio, etc.