Best quality Silicon Wafer For Semiconductors - Dicing & Back Grinding – Sibranch
Best quality Silicon Wafer For Semiconductors - Dicing & Back Grinding – Sibranch Detail:
Wafer Dicing & Back Grinding, Wafer Resizing
We provide quick and efficient custom wafer Dicing & Back Grinding and wafer resizing services. Over the years, we have worked with hundreds of satisfied customers all over the world. Our customers have been involved in an array of different industries, including MEMS, Military, Medical, Semiconductor and MicroOptics. This has allowed our team, which has a combined total of 20 years of experience, to work with virtually every type of material in the industry, including Alumina, BGA’s, Calcite, Ferrite, Fused Silica, Glass, Germanium, Gold, Lexan, PZT , Sapphire, SOI, SOS, EPI and Silicon wafers. We can accommodate all material sizes up to 300mm/ 12” in diameter and 10mm thick.
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To be a result of ours specialty and service consciousness, our enterprise has won an excellent status between buyers all around the globe for Best quality Silicon Wafer For Semiconductors - Dicing & Back Grinding – Sibranch, The product will supply to all over the world, such as: Maldives , Doha , Barbados , We warmly welcome domestic and overseas customers to visit our company and have business talk. Our company always insists on the principle of "good quality, reasonable price, the first-class service". We have been willing to build long-term, friendly and mutually beneficial cooperation with you.
By Ann from Kenya - 2016.06.29 18:55
Goods just received, we are very satisfied, a very good supplier, hope to make persistent efforts to do better.
By Adela from Latvia - 2015.06.12 16:22