| Growth | CZ, MCZ, FZ |
| Grade | Prime, Test, Dummy, etc. |
| Diameter | 8 inch / 200mm |
| Thickness | 600~1500um |
| Finish | As cut, lapped, etched,SSP,DSP, etc |
| Orientation | (100) etc |
| Off cut | Up to 4 deg |
| ype/Dopant | P/B, N/Phos, N/As, N/Sb, Intrinsic |
| Resistivity | CZ/MCZ : From 0.001 to 1000 ohm-cm |
| FZ : Up to 5000 ohm-cm | |
| Thin films | *PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20,000 Å / ± 5 % |
| *LPCVD/PECVD: Oxide, Nitride, SiC, etc , Coating thicknesses up to 200,000 Å /± 3 % | |
| *Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc) | |
| Processes | DSP, ultra thin, ultra flat, etc. |
| Downsizing, back grinding, dicing , etc. | |
| MEMS |
